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- 3DP-GEMMA vs 4070 FX
Gembird 3DP-GEMMA vs WASP 4070 FX
What 3DP-GEMMA does better (1) and where 4070 FX wins (4) — every spec side by side.
Why is 3DP-GEMMA better than 4070 FX?
- Weight3 kg vs 95 kg31.7×
Why is 4070 FX better than 3DP-GEMMA?
- Finest layer height0.1 mm vs 0.05 mm2×
- Wi-FiNo · 3DP-GEMMA: Yes
- Number of supported materials1 vs 77×
- EthernetNo · 3DP-GEMMA: Yes
Specifications
Side by side
| General | ||
| Technology | FDM / FFF (filament) | FDM / FFF (filament) |
| Motion system | — | Delta |
| Build volume | ||
| Build width (X) | 120 mm | — |
| Build depth (Y) | 110 mm | — |
| Build height (Z) | 100 mm | — |
| Build volume | 1.3 L | — |
| Speed | ||
| Max print speed | — | 200 mm/s |
| Print quality | ||
| Finest layer height | 0.1 mm | 0.05 mm |
| Thickest layer height | — | 0.35 mm |
| Extruder & hotend | ||
| Max nozzle temperature | — | 280 °C |
| Default nozzle | — | 0.7 mm |
| Supported materials | PLA | WASP — TPU, TPE, PP, other — PLA, PETG, ASA, ABS |
| Number of supported materials | 1 | 7 |
| Engineering materials (PA, PC, CF) | No | No |
| Print bed | ||
| Heated bed | — | Yes |
| Max bed temperature | — | 120 °C |
| Enclosure | ||
| Actively heated chamber | — | Yes |
| Max chamber temperature | — | 70 °C |
| Connectivity & control | ||
| Connectivity | USB, SD card | Wi-Fi, Ethernet, USB |
| Wi-Fi | No | Yes |
| Ethernet | No | Yes |
| USB | Yes | Yes |
| SD card | Yes | — |
| Bluetooth | No | — |
| Screen size | — | 7″ |
| Touchscreen | — | Yes |
| Size & power | ||
| Width | 210 mm | 850 mm |
| Depth | 210 mm | 770 mm |
| Height | 290 mm | 1,950 mm |
| Weight | 3 kg | 95 kg |
