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- 3DWOX 1X vs 2.0 Modular F350
Sindoh 3DWOX 1X vs Snapmaker 2.0 Modular F350
What 3DWOX 1X does better (1) and where 2.0 Modular F350 wins (4) — every spec side by side.
vs
6.1Build volume9.4
Why is 3DWOX 1X better than 2.0 Modular F350?
- EthernetYes · 2.0 Modular F350: No
Why is 2.0 Modular F350 better than 3DWOX 1X?
- Build volume13.7 L vs 37 L2.7×
- Build height (Z)300 mm vs 330 mm+10%
- Build depth (Y)200 mm vs 350 mm+75%
- Build width (X)228 mm vs 320 mm+40%
Specifications
Side by side
| General | ||
| Technology | FDM / FFF (filament) | — |
| Motion system | Bed-slinger (i3-style) | — |
| Build volume | ||
| Build width (X) | 228 mm | 320 mm |
| Build depth (Y) | 200 mm | 350 mm |
| Build height (Z) | 300 mm | 330 mm |
| Build volume | 13.7 L | 37 L |
| Print quality | ||
| Finest layer height | 0.05 mm | — |
| Thickest layer height | 0.4 mm | — |
| Automatic bed levelling | Yes | — |
| Extruder & hotend | ||
| Default nozzle | 0.4 mm | 0.4 mm |
| Filament diameter | 1.75 mm | — |
| Supported materials | PLA, ABS, ASA, PETG, PA, etc | — |
| Number of supported materials | 6 | — |
| Engineering materials (PA, PC, CF) | Yes | — |
| Connectivity & control | ||
| Connectivity | Wi-Fi, Ethernet, USB | Wi-Fi, USB |
| Wi-Fi | Yes | Yes |
| Ethernet | Yes | No |
| USB | Yes | Yes |
| SD card | — | No |
| Bluetooth | — | No |
| Touchscreen | Yes | Yes |
| Size & power | ||
| Width | 490 mm | — |
| Depth | 466 mm | — |
| Height | 573 mm | — |
| Weight | 31 kg | — |
| Rated power | — | 320 W |
