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- E2 vs E2 CF
Raise3D E2 vs Raise3D E2 CF
What E2 does better (1) and where E2 CF wins (0) — every spec side by side.
Dimensions
Size comparison
E2E2 CF
| E2 | E2 CF | Difference | |
|---|---|---|---|
| Height | 465 mm | 465 mm | = |
| Width | 607 mm | 596 mm | +11 mm |
| Depth | 596 mm | 607 mm | −11 mm |
Drawn to the same scale from the official dimensions (front and side).
Why is E2 better than E2 CF?
- Finest layer height0.02 mm vs 0.1 mm5×
Why is E2 CF better than E2?
E2 CF has no measurable advantages in this pair.
Specifications
Side by side
| General | ||
| Technology | FDM / FFF (filament) | FDM / FFF (filament) |
| Build volume | ||
| Build width (X) | 330 mm | 330 mm |
| Build depth (Y) | 240 mm | 240 mm |
| Build height (Z) | 240 mm | 240 mm |
| Build volume | 19 L | 19 L |
| Speed | ||
| Max print speed | 150 mm/s | 150 mm/s |
| Print quality | ||
| Finest layer height | 0.02 mm | 0.1 mm |
| Automatic bed levelling | Yes | Yes |
| Extruder & hotend | ||
| Max nozzle temperature | 300 °C | 300 °C |
| Default nozzle | 0.4 mm | 0.4 mm |
| Supported nozzle sizes (mm) | — | 0.4, 0.8 |
| Nozzles | 2 | 2 |
| Filament diameter | 1.75 mm | 1.75 mm |
| Supported materials | ABS, PLA, HIPS, PVA | ABS, PLA, HIPS, PVA |
| Number of supported materials | 4 | 4 |
| Engineering materials (PA, PC, CF) | No | No |
| Print bed | ||
| Heated bed | Yes | Yes |
| Max bed temperature | 110 °C | 110 °C |
| Enclosure | ||
| Enclosed build chamber | Yes | Yes |
| Connectivity & control | ||
| Connectivity | Wi-Fi, Ethernet, USB | Wi-Fi, Ethernet, USB |
| Wi-Fi | Yes | Yes |
| Ethernet | Yes | Yes |
| USB | Yes | Yes |
| SD card | No | No |
| Bluetooth | No | No |
| Touchscreen | Yes | Yes |
| Features | ||
| Built-in camera | Yes | Yes |
| Filament runout sensor | — | Yes |
| Power-loss recovery | Yes | Yes |
| Size & power | ||
| Width | 607 mm | 596 mm |
| Depth | 596 mm | 607 mm |
| Height | 465 mm | 465 mm |
| Weight | — | 32.4 kg |
| Rated power | 350 W | 350 W |
| Noise level | 50 dB | 50 dB |
