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- i-Fast vs E2
QIDI i-Fast vs Raise3D E2
What i-Fast does better (4) and where E2 wins (1) — every spec side by side.
Dimensions
Size comparison
i-FastE2
| i-Fast | E2 | Difference | |
|---|---|---|---|
| Height | 670 mm | 465 mm | +205 mm |
| Width | 710 mm | 607 mm | +103 mm |
| Depth | 510 mm | 596 mm | −86 mm |
Drawn to the same scale from the official dimensions (front and side).
Why is i-Fast better than E2?
- Build volume26.4 L vs 19 L+39%
- Max nozzle temperature350 °C vs 300 °C+17%
- Build height (Z)320 mm vs 240 mm+33%
- Build depth (Y)250 mm vs 240 mm+4%
Why is E2 better than i-Fast?
- Finest layer height0.05 mm vs 0.02 mm2.5×
Specifications
Side by side
| General | ||
| Technology | FDM / FFF (filament) | FDM / FFF (filament) |
| Build volume | ||
| Build width (X) | 330 mm | 330 mm |
| Build depth (Y) | 250 mm | 240 mm |
| Build height (Z) | 320 mm | 240 mm |
| Build volume | 26.4 L | 19 L |
| Speed | ||
| Max print speed | 150 mm/s | 150 mm/s |
| Print quality | ||
| Finest layer height | 0.05 mm | 0.02 mm |
| Automatic bed levelling | — | Yes |
| Extruder & hotend | ||
| Max nozzle temperature | 350 °C | 300 °C |
| Default nozzle | 0.4 mm | 0.4 mm |
| Nozzles | 2 | 2 |
| Filament diameter | — | 1.75 mm |
| Supported materials | — | ABS, PLA, HIPS, PVA |
| Number of supported materials | — | 4 |
| Engineering materials (PA, PC, CF) | — | No |
| Print bed | ||
| Heated bed | — | Yes |
| Max bed temperature | — | 110 °C |
| Enclosure | ||
| Enclosed build chamber | — | Yes |
| Connectivity & control | ||
| Connectivity | Wi-Fi, Ethernet, USB | Wi-Fi, Ethernet, USB |
| Wi-Fi | Yes | Yes |
| Ethernet | Yes | Yes |
| USB | Yes | Yes |
| SD card | — | No |
| Bluetooth | — | No |
| Touchscreen | — | Yes |
| Features | ||
| Built-in camera | — | Yes |
| Power-loss recovery | — | Yes |
| Size & power | ||
| Width | 710 mm | 607 mm |
| Depth | 510 mm | 596 mm |
| Height | 670 mm | 465 mm |
| Weight | 33 kg | — |
| Rated power | 700 W | 350 W |
| Noise level | — | 50 dB |
