- scrc.us.com
- Compare
- E3 vs X3
Raise3D E3 vs Zaxe X3
What E3 does better (4) and where X3 wins (2) — every spec side by side.
Dimensions
Size comparison
E3X3
| E3 | X3 | Difference | |
|---|---|---|---|
| Height | 487 mm | 530 mm | −43 mm |
| Width | 614 mm | 410 mm | +204 mm |
| Depth | 597 mm | 583 mm | +14 mm |
Drawn to the same scale from the official dimensions (front and side).
Why is E3 better than X3?
- Build volume19 L vs 12.7 L+50%
- Build width (X)330 mm vs 220 mm+50%
- Number of supported materials6 vs 5+20%
- Build depth (Y)240 mm vs 230 mm+4%
Why is X3 better than E3?
- Engineering materials (PA, PC, CF)No · E3: Yes
- Build height (Z)240 mm vs 250 mm+4%
Specifications
Side by side
| General | ||
| Technology | FDM / FFF (filament) | — |
| Build volume | ||
| Build width (X) | 330 mm | 220 mm |
| Build depth (Y) | 240 mm | 230 mm |
| Build height (Z) | 240 mm | 250 mm |
| Build volume | 19 L | 12.7 L |
| Speed | ||
| Max print speed | 200 mm/s | — |
| Extruder & hotend | ||
| Max nozzle temperature | 330 °C | — |
| Default nozzle | 0.4 mm | — |
| Filament diameter | 1.75 mm | 1.75 mm |
| Supported materials | PLA, ABS, ASA, PETG, PVA, TPU | PLA, ABS, PETG, Nylon, Wood |
| Number of supported materials | 6 | 5 |
| Engineering materials (PA, PC, CF) | No | Yes |
| Print bed | ||
| Heated bed | Yes | — |
| Max bed temperature | 110 °C | — |
| Connectivity & control | ||
| Connectivity | Wi-Fi, Ethernet, USB | Wi-Fi, Ethernet, USB |
| Wi-Fi | Yes | Yes |
| Ethernet | Yes | Yes |
| USB | Yes | Yes |
| SD card | No | No |
| Bluetooth | No | No |
| Touchscreen | Yes | Yes |
| Size & power | ||
| Width | 614 mm | 410 mm |
| Depth | 597 mm | 583 mm |
| Height | 487 mm | 530 mm |
| Weight | 33.3 kg | — |









