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- Guider 3 vs 2.0 Modular F350
Flashforge Guider 3 vs Snapmaker 2.0 Modular F350
What Guider 3 does better (2) and where 2.0 Modular F350 wins (3) — every spec side by side.
vs
8.3Build volume9.3
Why is Guider 3 better than 2.0 Modular F350?
- EthernetYes · 2.0 Modular F350: No
- Build height (Z)340 mm vs 330 mm+3%
Why is 2.0 Modular F350 better than Guider 3?
- Build volume25.5 L vs 37 L+45%
- Build depth (Y)250 mm vs 350 mm+40%
- Build width (X)300 mm vs 320 mm+7%
Specifications
Side by side
| General | ||
| Technology | FDM / FFF (filament) | — |
| Build volume | ||
| Build width (X) | 300 mm | 320 mm |
| Build depth (Y) | 250 mm | 350 mm |
| Build height (Z) | 340 mm | 330 mm |
| Build volume | 25.5 L | 37 L |
| Speed | ||
| Max print speed | 250 mm/s | — |
| Print quality | ||
| Finest layer height | 0.05 mm | — |
| Thickest layer height | 0.4 mm | — |
| Automatic bed levelling | Yes | — |
| Extruder & hotend | ||
| Max nozzle temperature | 320 °C | — |
| Default nozzle | 0.4 mm | 0.4 mm |
| Supported nozzle sizes (mm) | 0.4, 0.8 | — |
| Supported materials | ABS, PLA, PC, PA, HIPS, ASA, PETG, PA-CF, PLA-CF, PETG-CF, PETG-GF | — |
| Number of supported materials | 11 | — |
| Engineering materials (PA, PC, CF) | Yes | — |
| Print bed | ||
| Heated bed | Yes | — |
| Max bed temperature | 110 °C | — |
| Connectivity & control | ||
| Connectivity | Wi-Fi, Ethernet, USB | Wi-Fi, USB |
| Wi-Fi | Yes | Yes |
| Ethernet | Yes | No |
| USB | Yes | Yes |
| SD card | — | No |
| Bluetooth | — | No |
| App control | Yes | — |
| Screen size | 4.3″ | — |
| Touchscreen | Yes | Yes |
| Features | ||
| Filament runout sensor | Yes | — |
| Size & power | ||
| Width | 496 mm | — |
| Depth | 436 mm | — |
| Height | 696 mm | — |
| Weight | 27 kg | — |
| Rated power | — | 320 W |
