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- B1 vs 4070 Industrial X
BIQU B1 vs WASP 4070 Industrial X
What B1 does better (0) and where 4070 Industrial X wins (3) — every spec side by side.
vs
3.2Speed6.1
Why is B1 better than 4070 Industrial X?
B1 has no measurable advantages in this pair.
Why is 4070 Industrial X better than B1?
- Max print speed100 mm/s vs 200 mm/s2×
- Engineering materials (PA, PC, CF)No · B1: Yes
- Number of supported materials3 vs 113.7×
Specifications
Side by side
| General | ||
| Technology | FDM / FFF (filament) | FDM / FFF (filament) |
| Motion system | — | Delta |
| Build volume | ||
| Build width (X) | 235 mm | — |
| Build depth (Y) | 235 mm | — |
| Build height (Z) | 270 mm | — |
| Build volume | 14.9 L | — |
| Speed | ||
| Max print speed | 100 mm/s | 200 mm/s |
| Print quality | ||
| Finest layer height | — | 0.1 mm |
| Extruder & hotend | ||
| Default nozzle | — | 0.4 mm |
| Supported nozzle sizes (mm) | — | 0.4, 0.7 |
| Filament diameter | 1.75 mm | — |
| Supported materials | PLA, ABS, PETG | ASA, PLA, ABS, Flex, HIPS, PETG, TPU, Polypropylene, ABS+PC, PVA, PA carbon etc. |
| Number of supported materials | 3 | 11 |
| Engineering materials (PA, PC, CF) | No | Yes |
| Print bed | ||
| Heated bed | Yes | Yes |
| Max bed temperature | — | 70 °C |
| Enclosure | ||
| Enclosed build chamber | — | Yes |
| Connectivity & control | ||
| Connectivity | — | Wi-Fi, USB, SD card |
| Wi-Fi | — | Yes |
| USB | — | Yes |
| SD card | — | Yes |
| Touchscreen | Yes | Yes |
| Features | ||
| Filament runout sensor | — | Yes |
| Power-loss recovery | — | Yes |
| Size & power | ||
| Width | — | 850 mm |
| Depth | — | 770 mm |
| Height | — | 1,950 mm |
| Weight | — | 90 kg |
