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- B1 vs 2.0 F250
BIQU B1 vs Snapmaker 2.0 F250
What B1 does better (3) and where 2.0 F250 wins (2) — every spec side by side.
Why is B1 better than 2.0 F250?
- Build volume14.9 L vs 13.5 L+10%
- Build height (Z)270 mm vs 235 mm+15%
- Build width (X)235 mm vs 230 mm+2%
Why is 2.0 F250 better than B1?
- Number of supported materials3 vs 4+33%
- Build depth (Y)235 mm vs 250 mm+6%
Specifications
Side by side
| General | ||
| Technology | FDM / FFF (filament) | FDM / FFF (filament) |
| Delivered as | — | Kit |
| Build volume | ||
| Build width (X) | 235 mm | 230 mm |
| Build depth (Y) | 235 mm | 250 mm |
| Build height (Z) | 270 mm | 235 mm |
| Build volume | 14.9 L | 13.5 L |
| Speed | ||
| Max print speed | 100 mm/s | 100 mm/s |
| Print quality | ||
| Finest layer height | — | 0.05 mm |
| Thickest layer height | — | 0.3 mm |
| Extruder & hotend | ||
| Max nozzle temperature | — | 275 °C |
| Direct-drive extruder | — | Yes |
| Default nozzle | — | 0.4 mm |
| Toolheads | — | 1 |
| Nozzles | — | 1 |
| Filament diameter | 1.75 mm | 1.75 mm |
| Supported materials | PLA, ABS, PETG | ABS, PETG, PLA, TPU |
| Number of supported materials | 3 | 4 |
| Engineering materials (PA, PC, CF) | No | No |
| Print bed | ||
| Heated bed | Yes | Yes |
| Max bed temperature | — | 80 °C |
| Enclosure | ||
| Enclosed build chamber | — | No |
| Connectivity & control | ||
| Connectivity | — | Wi-Fi, USB |
| Wi-Fi | — | Yes |
| USB | — | Yes |
| Screen size | — | 5″ |
| Touchscreen | Yes | Yes |
| Features | ||
| Built-in camera | — | No |
| Size & power | ||
| Width | — | 405 mm |
| Depth | — | 424 mm |
| Height | — | 490 mm |
| Rated power | — | 320 W |
