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- B1 vs 3DWOX 1X
BIQU B1 vs Sindoh 3DWOX 1X
What B1 does better (3) and where 3DWOX 1X wins (3) — every spec side by side.
Why is B1 better than 3DWOX 1X?
- Build volume14.9 L vs 13.7 L+9%
- Build depth (Y)235 mm vs 200 mm+18%
- Build width (X)235 mm vs 228 mm+3%
Why is 3DWOX 1X better than B1?
- Engineering materials (PA, PC, CF)No · B1: Yes
- Number of supported materials3 vs 62×
- Build height (Z)270 mm vs 300 mm+11%
Specifications
Side by side
| General | ||
| Technology | FDM / FFF (filament) | FDM / FFF (filament) |
| Motion system | — | Bed-slinger (i3-style) |
| Build volume | ||
| Build width (X) | 235 mm | 228 mm |
| Build depth (Y) | 235 mm | 200 mm |
| Build height (Z) | 270 mm | 300 mm |
| Build volume | 14.9 L | 13.7 L |
| Speed | ||
| Max print speed | 100 mm/s | — |
| Print quality | ||
| Finest layer height | — | 0.05 mm |
| Thickest layer height | — | 0.4 mm |
| Automatic bed levelling | — | Yes |
| Extruder & hotend | ||
| Default nozzle | — | 0.4 mm |
| Filament diameter | 1.75 mm | 1.75 mm |
| Supported materials | PLA, ABS, PETG | PLA, ABS, ASA, PETG, PA, etc |
| Number of supported materials | 3 | 6 |
| Engineering materials (PA, PC, CF) | No | Yes |
| Print bed | ||
| Heated bed | Yes | — |
| Connectivity & control | ||
| Connectivity | — | Wi-Fi, Ethernet, USB |
| Wi-Fi | — | Yes |
| Ethernet | — | Yes |
| USB | — | Yes |
| Touchscreen | Yes | Yes |
| Size & power | ||
| Width | — | 490 mm |
| Depth | — | 466 mm |
| Height | — | 573 mm |
| Weight | — | 31 kg |
