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- HTX vs 4070 Industrial X
3DLabs HTX vs WASP 4070 Industrial X
What HTX does better (2) and where 4070 Industrial X wins (1) — every spec side by side.
vs
9.7Material versatility6.3
Why is HTX better than 4070 Industrial X?
- Finest layer height0.04 mm vs 0.1 mm2.5×
- Max bed temperature220 °C vs 70 °C3.1×
Why is 4070 Industrial X better than HTX?
- Number of supported materials6 vs 11+83%
Specifications
Side by side
| General | ||
| Technology | FDM / FFF (filament) | FDM / FFF (filament) |
| Motion system | — | Delta |
| Build volume | ||
| Build width (X) | 350 mm | — |
| Build depth (Y) | 300 mm | — |
| Build height (Z) | 300 mm | — |
| Build volume | 31.5 L | — |
| Speed | ||
| Max print speed | — | 200 mm/s |
| Print quality | ||
| Finest layer height | 0.04 mm | 0.1 mm |
| Extruder & hotend | ||
| Max nozzle temperature | 500 °C | — |
| Default nozzle | — | 0.4 mm |
| Supported nozzle sizes (mm) | — | 0.4, 0.7 |
| Supported materials | ABS, ASA, PC, PEEK, PEI, PEKK | ASA, PLA, ABS, Flex, HIPS, PETG, TPU, Polypropylene, ABS+PC, PVA, PA carbon etc. |
| Number of supported materials | 6 | 11 |
| Engineering materials (PA, PC, CF) | Yes | Yes |
| Print bed | ||
| Heated bed | Yes | Yes |
| Max bed temperature | 220 °C | 70 °C |
| Enclosure | ||
| Enclosed build chamber | — | Yes |
| Actively heated chamber | Yes | — |
| Max chamber temperature | 100 °C | — |
| Connectivity & control | ||
| Connectivity | Ethernet, USB | Wi-Fi, USB, SD card |
| Wi-Fi | — | Yes |
| Ethernet | Yes | — |
| USB | Yes | Yes |
| SD card | — | Yes |
| Screen size | 7″ | — |
| Touchscreen | Yes | Yes |
| Features | ||
| Filament runout sensor | Yes | Yes |
| Power-loss recovery | — | Yes |
| Size & power | ||
| Width | — | 850 mm |
| Depth | — | 770 mm |
| Height | — | 1,950 mm |
| Weight | — | 90 kg |
