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- HTX vs 4070 FX
3DLabs HTX vs WASP 4070 FX
What HTX does better (5) and where 4070 FX wins (1) — every spec side by side.
Why is HTX better than 4070 FX?
- Max nozzle temperature500 °C vs 280 °C+79%
- Engineering materials (PA, PC, CF)Yes · 4070 FX: No
- Max bed temperature220 °C vs 120 °C+83%
- Finest layer height0.04 mm vs 0.05 mm+25%
- Max chamber temperature100 °C vs 70 °C+43%
Why is 4070 FX better than HTX?
- Number of supported materials6 vs 7+17%
Specifications
Side by side
| General | ||
| Technology | FDM / FFF (filament) | FDM / FFF (filament) |
| Motion system | — | Delta |
| Build volume | ||
| Build width (X) | 350 mm | — |
| Build depth (Y) | 300 mm | — |
| Build height (Z) | 300 mm | — |
| Build volume | 31.5 L | — |
| Speed | ||
| Max print speed | — | 200 mm/s |
| Print quality | ||
| Finest layer height | 0.04 mm | 0.05 mm |
| Thickest layer height | — | 0.35 mm |
| Extruder & hotend | ||
| Max nozzle temperature | 500 °C | 280 °C |
| Default nozzle | — | 0.7 mm |
| Supported materials | ABS, ASA, PC, PEEK, PEI, PEKK | WASP — TPU, TPE, PP, other — PLA, PETG, ASA, ABS |
| Number of supported materials | 6 | 7 |
| Engineering materials (PA, PC, CF) | Yes | No |
| Print bed | ||
| Heated bed | Yes | Yes |
| Max bed temperature | 220 °C | 120 °C |
| Enclosure | ||
| Actively heated chamber | Yes | Yes |
| Max chamber temperature | 100 °C | 70 °C |
| Connectivity & control | ||
| Connectivity | Ethernet, USB | Wi-Fi, Ethernet, USB |
| Wi-Fi | — | Yes |
| Ethernet | Yes | Yes |
| USB | Yes | Yes |
| Screen size | 7″ | 7″ |
| Touchscreen | Yes | Yes |
| Features | ||
| Filament runout sensor | Yes | — |
| Size & power | ||
| Width | — | 850 mm |
| Depth | — | 770 mm |
| Height | — | 1,950 mm |
| Weight | — | 95 kg |
