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- H2S vs SV08 Max
Bambu Lab H2S vs Sovol SV08 Max
What H2S does better (7) and where SV08 Max wins (9) — every spec side by side.
Dimensions
Size comparison
H2SSV08 Max
| H2S | SV08 Max | Difference | |
|---|---|---|---|
| Height | 626 mm | 750 mm | −124 mm |
| Width | 492 mm | 700 mm | −208 mm |
| Depth | 514 mm | 710 mm | −196 mm |
| Weight | 30 kg | 21.5 kg | +8.5 kg |
Drawn to the same scale from the official dimensions (front and side).
Why is H2S better than SV08 Max?
- Actively heated chamberYes · SV08 Max: No
- Max print speed1,000 mm/s vs 700 mm/s+43%
- Max nozzle temperature350 °C vs 300 °C+17%
- Max volumetric flow65 mm³/s vs 50 mm³/s+30%
- Delivered asFully assembled vs Kit
- TouchscreenYes · SV08 Max: No
- Max bed temperature120 °C vs 100 °C+20%
Why is SV08 Max better than H2S?
- Build volume37 L vs 125 L3.4×
- Max acceleration20,000 mm/s² vs 40,000 mm/s²2×
- Engineering materials (PA, PC, CF)No · H2S: Yes
- Build height (Z)320 mm vs 500 mm+56%
- EthernetNo · H2S: Yes
- Number of supported materials4 vs 7+75%
- Build width (X)340 mm vs 500 mm+47%
- Build depth (Y)340 mm vs 500 mm+47%
- Weight30 kg vs 21.5 kg+40%
Specifications
Side by side
| General | ||
| Technology | FDM / FFF (filament) | FDM / FFF (filament) |
| Motion system | CoreXY / XY-head | CoreXY / XY-head |
| Delivered as | Fully assembled | Kit |
| All-metal frame | Yes | — |
| Klipper firmware | — | Yes |
| Build volume | ||
| Build width (X) | 340 mm | 500 mm |
| Build depth (Y) | 340 mm | 500 mm |
| Build height (Z) | 320 mm | 500 mm |
| Build volume | 37 L | 125 L |
| Speed | ||
| Max print speed | 1,000 mm/s | 700 mm/s |
| Max acceleration | 20,000 mm/s² | 40,000 mm/s² |
| Max volumetric flow | 65 mm³/s | 50 mm³/s |
| Print quality | ||
| Finest layer height | — | 0.08 mm |
| Thickest layer height | — | 0.36 mm |
| Vibration compensation (input shaping) | — | Yes |
| Automatic bed levelling | — | Yes |
| Extruder & hotend | ||
| Max nozzle temperature | 350 °C | 300 °C |
| Direct-drive extruder | Yes | Yes |
| Default nozzle | 0.4 mm | 0.4 mm |
| Supported nozzle sizes (mm) | — | 0.4, 0.8 |
| Nozzle material | steel | — |
| Swappable nozzle / hotend | Yes | — |
| Toolheads | 1 | 1 |
| Nozzles | 1 | 1 |
| Filament diameter | 1.75 mm | 1.75 mm |
| Supported materials | ABS, PETG, PLA, TPU | ABS, ASA, PA, PC, PETG, PLA, TPU |
| Number of supported materials | 4 | 7 |
| Engineering materials (PA, PC, CF) | No | Yes |
| Multi-colour | ||
| Multi-colour printing | Yes | — |
| Max colours / materials | 4 | — |
| Multi-colour system | AMS | — |
| Print bed | ||
| Heated bed | Yes | Yes |
| Max bed temperature | 120 °C | 100 °C |
| Enclosure | ||
| Enclosed build chamber | Yes | — |
| Actively heated chamber | Yes | No |
| Max chamber temperature | 65 °C | — |
| Air filter (carbon / HEPA) | Yes | — |
| Chamber light | Yes | — |
| Door sensor | Yes | — |
| Connectivity & control | ||
| Connectivity | Wi-Fi, USB | Wi-Fi, Ethernet, USB |
| Wi-Fi | Yes | Yes |
| Ethernet | No | Yes |
| USB | Yes | Yes |
| SD card | No | No |
| Bluetooth | No | No |
| App control | Yes | — |
| Screen size | 5″ | — |
| Touchscreen | Yes | No |
| Features | ||
| Built-in camera | Yes | Yes |
| Camera resolution | 2.1 MP | — |
| Filament runout sensor | — | Yes |
| Power-loss recovery | Yes | Yes |
| Laser engraving module | Yes | — |
| Size & power | ||
| Width | 492 mm | 700 mm |
| Depth | 514 mm | 710 mm |
| Height | 626 mm | 750 mm |
| Weight | 30 kg | 21.5 kg |
| Rated power | 2,050 W | — |
