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- 3DP-GEMMA vs 4070 Industrial X
Gembird 3DP-GEMMA vs WASP 4070 Industrial X
What 3DP-GEMMA does better (1) and where 4070 Industrial X wins (3) — every spec side by side.
vs
Why is 3DP-GEMMA better than 4070 Industrial X?
- Weight3 kg vs 90 kg30×
Why is 4070 Industrial X better than 3DP-GEMMA?
- Engineering materials (PA, PC, CF)No · 3DP-GEMMA: Yes
- Wi-FiNo · 3DP-GEMMA: Yes
- Number of supported materials1 vs 1111×
Specifications
Side by side
| General | ||
| Technology | FDM / FFF (filament) | FDM / FFF (filament) |
| Motion system | — | Delta |
| Build volume | ||
| Build width (X) | 120 mm | — |
| Build depth (Y) | 110 mm | — |
| Build height (Z) | 100 mm | — |
| Build volume | 1.3 L | — |
| Speed | ||
| Max print speed | — | 200 mm/s |
| Print quality | ||
| Finest layer height | 0.1 mm | 0.1 mm |
| Extruder & hotend | ||
| Default nozzle | — | 0.4 mm |
| Supported nozzle sizes (mm) | — | 0.4, 0.7 |
| Supported materials | PLA | ASA, PLA, ABS, Flex, HIPS, PETG, TPU, Polypropylene, ABS+PC, PVA, PA carbon etc. |
| Number of supported materials | 1 | 11 |
| Engineering materials (PA, PC, CF) | No | Yes |
| Print bed | ||
| Heated bed | — | Yes |
| Max bed temperature | — | 70 °C |
| Enclosure | ||
| Enclosed build chamber | — | Yes |
| Connectivity & control | ||
| Connectivity | USB, SD card | Wi-Fi, USB, SD card |
| Wi-Fi | No | Yes |
| Ethernet | No | — |
| USB | Yes | Yes |
| SD card | Yes | Yes |
| Bluetooth | No | — |
| Touchscreen | — | Yes |
| Features | ||
| Filament runout sensor | — | Yes |
| Power-loss recovery | — | Yes |
| Size & power | ||
| Width | 210 mm | 850 mm |
| Depth | 210 mm | 770 mm |
| Height | 290 mm | 1,950 mm |
| Weight | 3 kg | 90 kg |
